| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4B2G1646F-BMMA |
|
IC |
SAMSUNG/三星 |
FBGA96 |
22+ |
27000 |
||
| SDINBDG4-8G-ZAT2 |
|
IC |
SANDISK/闪迪 |
BGA |
23+ |
5000 |
||
| W9751G6KB-25 |
|
IC |
WINBOND/华邦 |
FBGA84 |
21+ |
75000 |
||
| APQ-8053-A-792NSP-TR-01-1-AC |
|
IC |
QUALCOMM/高通 |
BGA |
22+ |
5200 |
||
| MT53E128M32D2DS-053 WT:A |
|
IC |
MICRON/美光 |
FBGA200 |
25+ |
21000 |
||
| THGBMTG5D1LBAIL | IC |
KIOXIA/铠侠 |
FBGA153 |
25+ |
15000 |
|||
| MT53E256M32D2DS-053 WT:B |
|
IC |
MICRON/美光 |
BGA |
24+ |
6522 |
||
| TSUMV53RWUT-Z1 |
|
IC |
MTK/联发科 |
QFN128 |
25+ |
15200 |
||
| NT6CL512T32AM-H1 |
|
IC |
NANYA/南亚 |
FBGA178 |
24+ |
15000 |
||
| TSUMV53RUU-Z1 |
|
IC |
MTK/联发科 |
QFN128 |
25+ |
95200 |
||
| W979H2KBVX2I |
|
IC |
WINBOND/华邦 |
FBGA134 |
21+ |
35000 |
||
| HI3536CRBCV100 |
|
IC |
HISILICON/海思 |
BGA427 |
21+ |
70000 |
||
| TC58NVG2S0HTA00 |
|
IC |
TOSHIBA/东芝 |
TSOP48 |
21+ |
130000 |
||
| RTL8211FI-CG |
|
IC |
REALTEK/瑞昱 |
QFN40 |
22+ |
4900 |
||
| NT5TU32M16FG-AC |
|
IC |
NANYA/南亚 |
BGA84 |
23+ |
100200 |
||
| TC58NVG1S3HTA00 |
|
IC |
TOSHIBA/东芝 |
TSOP48 |
21+ |
820000 |
||
| TC58NVG1S3ETA00 |
|
IC |
TOSHIBA/东芝 |
TSOP48 |
19+ |
130000 |
||
| K4A8G085WC-BIWE |
|
IC |
SAMSUNG/三星 |
FBGA78 |
23+ |
98000 |
||
| TSUMV56RUU-Z1 |
|
IC |
MTK/联发科 |
TQFP128 |
24+ |
90000 |
||
| MT40A512M8SA-062E IT:F |
|
IC |
MICRON/美光 |
BGA |
22+ |
39000 |
商家默认展示20条库存